9th International Conference on Solidification Science and Processing (ICSSP9 2026)
Triennial conference on solidification science with invited oral talks and contributed posters in single-session format, covering fundamentals, modelling, microstructure evolution and solidification processing. The paper call has closed; registration to attend is open until 31 October 2026.
- 5 Dec 2026 to 8 Dec 2026
- Indian Institute of Technology Hyderabad
- Department of Materials Science and Metallurgical Engineering, IIT Hyderabad
- Sangareddy, Telangana, India
Fee structure
| Category | Fee |
|---|---|
| Indian Participant | Rs. 12,000 early (until Sep 30, 2026) / Rs. 15,000 late, inclusive of all taxes |
| Indian Spouse/Student | Rs. 6,000 early / Rs. 7,500 late |
| Overseas Participant | US$ 500 early / US$ 600 late |
| Overseas Spouse/Student | US$ 250 early / US$ 300 late |
Important dates
- Abstract submission15 Aug 2026
- Registration closes31 Oct 2026
Contact
Thrust areas
Fundamentals of solidification and meltingModelling of solidificationMicrostructure evolutionRapid solidificationThermophysical propertiesMultiphase flowHot tearing, shrinkage and porosityAdditive manufacturing and welding
Checked against the organiser's official page or brochure · listed 15 Oct 2026